Capabilities

High-speed and mixed-signal electronics design. Power architecture, grounding, and thermal considerations. Signal integrity, power integrity, and regulatory alignment from initial architecture.

• •High-speed and mixed-signal electronics design
• •Power architecture, grounding, and thermal considerations
• •Signal integrity (SI) and power integrity (PI) analysis
• •Multi-layer PCB design and stackup optimization
• •EMI/EMC, ESD, and regulatory alignment
• •Component selection, lifecycle management, DFM/DFA

Software running on processors for deterministic behavior and system control. Bare-metal, RTOS, and embedded Linux, matched to system timing, reliability, and field support requirements.

• •Bare-metal and RTOS development for deterministic control
• •Embedded Linux BSPs, drivers, and user-space applications
• •Device drivers and hardware abstraction layers
• •Communications and control protocols (SPI, I²C, UART, CAN, Ethernet)
• •Boot flows, diagnostics, logging, and update mechanisms
• •Processor and MCU selection aligned with system constraints

Programmable logic, acceleration, and the hardware-software boundary. RTL, IP integration, and hardware-software co-design aligned with system timing and verification.

• •RTL design and IP core integration
• •Timing closure and deterministic data paths
• •High-speed interfaces, memory controllers, and transceivers
• •Hardware-software co-design on SoC platforms (Zynq, Versal, RFSoC)
• •DSP pipelines and on-fabric acceleration
• •Functional verification, simulation, and board-level integration

Hardware-accelerated AI integrated into embedded and sensing platforms. From model optimization to deployment, we deliver deterministic, real-time inference aligned with system constraints.

• •Platform bring-up across ARM, NPU, DSP, GPU, and FPGA
• •Model optimization (quantization, pruning, ONNX/TensorRT/TFLite)
• •Runtime integration under latency, memory, and power constraints
• •Sensor preprocessing for radar, vision, audio, IMU, and LiDAR
• •Real-time pipeline design and performance benchmarking

System-level RF and millimeter-wave hardware engineering from transceiver architecture through high-frequency implementation and validation.

• •RF & mmWave transceiver architecture (sub-GHz to 77+ GHz)
• •Front-end design: LNA/PA stages, filtering, mixers, LO planning
• •Antenna and array design, simulation, and platform integration
• •Phased-array beamforming architecture and beam steering control
• •Full-wave electromagnetic simulation and optimization
• •Controlled-impedance PCB & high-frequency stack-up design
• •RF calibration and hardware validation strategy

System architecture and signal processing design for radar and sensing systems, from mission requirements and waveform definition through validated processing chains and integration.

• •Waveform design (FMCW, pulsed, LFM) and timing architecture
• •Range/Doppler processing pipelines
• •Detection (CFAR), estimation, and multi-target tracking
• •Synchronization, timing, and calibration strategy
• •HW/FPGA/firmware partitioning
• •Performance analysis and test/validation planning

End-to-end engineering support for safety-critical and secure automotive systems, integrating functional safety and cybersecurity processes and work products across the full lifecycle for ADAS and electric vehicle platforms.

• •Hazard and risk analysis (HAZOP, HARA) and safety goal definition
• •Requirements management and ASIL decomposition
• •FMEDA and FTA for safety analysis and verification
• •Audits, assessments, and gap analysis against safety standards
• •Cybersecurity threat analysis and risk assessment (TARA)
• •Security requirements definition and validation per ISO/SAE 21434
• •SOTIF/STPA analysis and ISO 21448 compliance support
• •AI/ML safety engineering per ISO/PAS 8800 and UL 4600 for autonomous systems

Mechanical design and packaging for electronics in demanding environments. Enclosure architecture, thermal management, structural analysis, and material selection aligned with production and environmental qualification.

• •Custom enclosure design for IP67, harsh-environment, and space-grade applications
• •High-tolerance mechanical design for RF, mmWave, and antenna structures
• •Thermal design and CFD simulation for heat dissipation and airflow
• •Structural and stress analysis (FEA) for vibration, shock, and mechanical loading
• •Material selection for performance, environmental resistance, and weight
• •DFM/DFA for reliable manufacturing and efficient assembly
• •Environmental qualification: thermal cycling, UV aging, ingress protection, and EMI shielding