Rayatron

System-Level Engineering

Capabilities

Full-cycle system engineering, from architecture through verification, across hardware, embedded systems, RF, and edge AI.

Rayatron delivers end-to-end system-level engineering, from architecture and design through verification and deployment. Hardware, embedded systems, programmable logic, RF, and edge intelligence are integrated into coherent, production-ready platforms with defined interfaces, traceable decisions, and verified performance.

Core Domains

Integrated Engineering Stack

Each domain is delivered with clear interfaces, test strategy, and integration ownership. Projects move from concept to validated hardware.

PCB layout and mixed-signal electronics hardware design
HW

Electronics & Hardware Design

High-speed and mixed-signal electronics design. Power architecture, grounding, and thermal considerations. Signal integrity, power integrity, and regulatory alignment from initial architecture.

  • High-speed and mixed-signal electronics design
  • Power architecture, grounding, and thermal considerations
  • Signal integrity (SI) and power integrity (PI) analysis
  • Multi-layer PCB design and stackup optimization
  • EMI/EMC, ESD, and regulatory alignment
  • Component selection, lifecycle management, DFM/DFA

Deliverables

Schematics, PCB layout, stackup definition, SI/PI analysis, BOM, fabrication and assembly package, bring-up and validation plan

Embedded software and firmware development
FW

Embedded Software & Firmware

Software running on processors for deterministic behavior and system control. Bare-metal, RTOS, and embedded Linux, matched to system timing, reliability, and field support requirements.

  • Bare-metal and RTOS development for deterministic control
  • Embedded Linux BSPs, drivers, and user-space applications
  • Device drivers and hardware abstraction layers
  • Communications and control protocols (SPI, I²C, UART, CAN, Ethernet)
  • Boot flows, diagnostics, logging, and update mechanisms
  • Processor and MCU selection aligned with system constraints

Deliverables

Source code, BSPs and drivers, build and release workflows, interface documentation, verification and system test results

FPGA and SoC integration for programmable logic and hardware-software co-design
FPGA

FPGA & SoC Integration

Programmable logic, acceleration, and the hardware-software boundary. RTL, IP integration, and hardware-software co-design aligned with system timing and verification.

  • RTL design and IP core integration
  • Timing closure and deterministic data paths
  • High-speed interfaces, memory controllers, and transceivers
  • Hardware-software co-design on SoC platforms (Zynq, Versal, RFSoC)
  • DSP pipelines and on-fabric acceleration
  • Functional verification, simulation, and board-level integration

Deliverables

RTL and IP cores, constraints and synthesis reports, software interfaces, integration notes, test vectors, and verification results

RF, mmWave and antenna systems hardware engineering
RF

RF, mmWave & Antenna Systems

System-level RF and millimeter-wave hardware engineering from transceiver architecture through high-frequency implementation and validation.

  • RF & mmWave transceiver architecture (sub-GHz to 77+ GHz)
  • Front-end design: LNA/PA stages, filtering, mixers, LO planning
  • Antenna and array design, simulation, and platform integration
  • Phased-array beamforming architecture and beam steering control
  • Full-wave electromagnetic simulation and optimization
  • Controlled-impedance PCB & high-frequency stack-up design
  • RF calibration and hardware validation strategy

Deliverables

RF schematics & impedance-controlled PCB layout, antenna design and test documentation, link budget and loss analysis, RF validation and characterization report, build documentation for repeatable production

Radar and sensing systems signal processing hardware
SENSE

Radar & Sensing Systems

System architecture and signal processing design for radar and sensing systems, from mission requirements and waveform definition through validated processing chains and integration.

  • Waveform design (FMCW, pulsed, LFM) and timing architecture
  • Range/Doppler processing pipelines
  • Detection (CFAR), estimation, and multi-target tracking
  • Synchronization, timing, and calibration strategy
  • HW/FPGA/firmware partitioning
  • Performance analysis and test/validation planning

Deliverables

System architecture specification, signal processing chain documentation, hardware/software integration plan, test procedures and validation report

Edge AI and embedded intelligence hardware acceleration
EDGE

Edge AI & Embedded Intelligence

Hardware-accelerated AI integrated into embedded and sensing platforms. From model optimization to deployment, we deliver deterministic, real-time inference aligned with system constraints.

  • Platform bring-up across ARM, NPU, DSP, GPU, and FPGA
  • Model optimization (quantization, pruning, ONNX/TensorRT/TFLite)
  • Runtime integration under latency, memory, and power constraints
  • Sensor preprocessing for radar, vision, audio, IMU, and LiDAR
  • Real-time pipeline design and performance benchmarking

Deliverables

Optimized model artifacts, runtime integration, sensor pipelines, and validated performance reports

Mechanical integration and packaging for electronics in demanding environments
MECH

Mechanical Integration & Packaging

Mechanical design and packaging for electronics in demanding environments. Enclosure architecture, thermal management, structural analysis, and material selection aligned with production and environmental qualification.

  • Custom enclosure design for IP67, harsh-environment, and space-grade applications
  • High-tolerance mechanical design for RF, mmWave, and antenna structures
  • Thermal design and CFD simulation for heat dissipation and airflow
  • Structural and stress analysis (FEA) for vibration, shock, and mechanical loading
  • Material selection for performance, environmental resistance, and weight
  • DFM/DFA for reliable manufacturing and efficient assembly
  • Environmental qualification: thermal cycling, UV aging, ingress protection, and EMI shielding

Deliverables

CAD models and drawings, material and hardware BOM, thermal and FEA analysis reports, DFM/assembly documentation, environmental test plan

How We Work

Engineering Workflow

Structured execution from requirements to validated subsystems. Designed for integration, test, and production realities.

01

Define

Architecture & Interfaces

02

Build

Implementation & Integration

03

Verify

Validation & Compliance

Discuss Your System Requirements

Share a brief, block diagram, or constraints. We'll respond with the right engineer and a practical next step.